In brief
Samsung Electronics chairman Lee Jae‑young visited the APL (Advanced Package Lab) in Yokohama, Japan, to talk about progress in advanced semiconductor packaging for AI chips. The lab, opened in September 2024, aims to harness Japan’s strengths and will receive a 350 billion‑won investment over five years. Lee underscored the importance of packaging technology for staying competitive in the AI‑driven semiconductor market.
Samsung Electronics chairman Lee Jae‑young visited the company’s APL in Yokohama, Japan, on Sunday to talk about advances in semiconductor packaging for AI chips.
The Advanced Package Lab was opened in September 2024 after two years of preparation, and it serves as a global R&D hub for technologies that improve AI chip performance.
In a meeting with APL researchers, Lee discussed progress in developing key materials and process technologies for advanced packaging, and ways to strengthen cooperation with Japanese companies in materials, components and equipment sectors.
Lee stressed that securing advanced packaging technologies is essential to maintaining competitiveness in the semiconductor industry in the age of AI.
Samsung plans to invest 350 billion won (US $262 million) in the APL over the next five years through 2028.
The company announced that the facility will continue to expand its research activities, building on the lab’s first year of operation and strategic collaboration with Japanese partners.
